Product Description
Our Orbital Weld Tee is expertly engineered for high-purity gas delivery systems in the semiconductor industry, where maintaining gas purity at ultra-high levels is critical. Manufactured from 316L stainless steel with electrolytic polishing (Ra ≤ 0.25μm), this fitting ensures minimal contamination, exceptional corrosion resistance, and outstanding mechanical strength.
Why Choose This Orbital Weld Tee for High-Purity Semiconductor Gas Systems?
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Material Excellence: Made from 316L stainless steel, known for its low carbon content and excellent resistance to corrosion and contamination, essential for ultra-high purity gas delivery.
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Electrolytic Polished Surface: The internal surface is polished to a roughness average of Ra ≤ 0.25μm, drastically reducing particle adhesion and preventing gas impurity contamination, meeting the stringent requirements of semiconductor gas pipelines.
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Forged Construction for Superior Sealing: The forged manufacturing process produces a dense and uniform metal structure, significantly enhancing the fitting’s sealing performance. This ensures excellent leak-tightness and mechanical strength, critical for maintaining system integrity under pressures up to 3000 psig in high-purity gas applications.
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Size Range: Available from 1/4" to 1" inch, compatible with typical semiconductor gas piping standards.
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Double Clean Packaging: Guarantees product cleanliness upon delivery, preventing contamination before installation
Key Technical Specifications
Feature
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Specification
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Product Name
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Orbital Weld Tee
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Material
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316L Stainless Steel
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Size Range
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1/4" to 1" inch
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Surface Finish
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Electrolytic Polishing (Ra ≤ 0.25μm)
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Manufacturing Method
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Forged
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Max Pressure
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3000 psig
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Packaging
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Double Clean Packaging
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Application in Semiconductor High-Purity Gas Systems
In semiconductor manufacturing, high-purity gases such as nitrogen, hydrogen, argon, and specialty gases must be delivered with minimal contamination to ensure device performance and yield. The Orbital Weld Tee is designed to:
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Maintain ultra-low impurity levels by minimizing surface roughness and particle generation.
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Resist corrosion and prevent metal particulate contamination, critical for gases with corrosive properties.
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Support continuous gas flow with minimal dead space, reducing risk of gas stagnation and impurity buildup.
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Withstand high pressures typical in semiconductor gas delivery systems, ensuring safety and system integrity.
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Provide enhanced sealing performance due to its forged construction, reducing leakage risks and ensuring stable, reliable operation in critical high-purity gas lines